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Shielded SMD Power Inductors LanTu Micro SDRH105R-331MT Designed for Demanding Electronic Applications

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Shielded SMD Power Inductors LanTu Micro SDRH105R-331MT Designed for Demanding Electronic Applications

Current - Saturation (Isat) : 850mA

Description : 850mA SMD,10.5x10.3mm Fixed Inductors RoHS

Mfr. Part # : SDRH105R-331MT

Model Number : SDRH105R-331MT

Package : SMD,10.5x10.3mm

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Product Overview

The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding electronic applications. Featuring a closed magnetic circuit design that minimizes leakage flux, these inductors offer high saturation current and low DC resistance. Their highly accurate dimensions ensure suitability for automatic mounting processes. Available in various package sizes and a wide inductance range, they comply with RoHS, Halogen Free, and REACH standards. These inductors are ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Series: SDRH105R
Type: Shielded SMD Power Inductors
Certifications: RoHS, Halogen Free, REACH Compliance
Origin: Shenzhen, China (implied by company name and location)

Technical Specifications

General Specifications:

Parameter	Value
Operating Temperature	-40 to +125 (including coil self-temperature rise)
Test Frequency (Inductance)	100KHz
Test Equipment (Inductance)	HP4284A, HP4285A or equivalent LCR meter
Test Equipment (Current)	HP4284+42841A
Test Equipment (DCR)	Chroma 16502 or equivalent
Saturation Current Definition	DC current at which inductance drops 30% from its value without current.
Temperature Rise Current Definition	The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current Definition	The lesser value between Isat and Irms.

Product Identification:

Component	Description
	Type: SDRH (Shielded SMD Power Inductors)
	Outer Dimensions (LWH) (mm): 105R (10.310.55.0)
	Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
	Inductance Value: e.g., 100 (for 10 H)
	Packing: T (Tape & Reel), B (Bulk Package)

Dimensions:

Part No.	A (Max)	B (Max)	C (Max)	D	E	F	H	I	J
SDRH105R	10.3	10.5	5.0	7.7	3.0	1.2	3.6	1.7	7.3

Electrical Characteristics:

Part No.	Inductance (H)	Tol.	DCR () Max	Saturation Current (A) Max	Temperature Rise Current (A) Max
SDRH105R-3R3N	3.3	30%	0.013	9.50	6.50
SDRH105R-4R7N	4.7	30%	0.016	9.20	6.30
SDRH105R-6R8N	6.8	30%	0.020	7.00	6.00
SDRH105R-8R2N	8.2	30%	0.023	5.50	5.00
SDRH105R-100N	10	30%	0.250	5.10	4.40
SDRH105R-120N	12	30%	0.032	4.90	4.00
SDRH105R-150N	15	30%	0.040	4.20	3.60
SDRH105R-180M	18	20%	0.046	3.70	3.40
SDRH105R-220M	22	20%	0.058	3.30	3.20
SDRH105R-270M	27	20%	0.650	3.20	3.00
SDRH105R-330M	33	20%	0.810	2.70	2.60
SDRH105R-390M	39	20%	0.103	2.48	2.50
SDRH105R-470M	47	20%	0.122	2.35	2.30
SDRH105R-560M	56	20%	0.144	2.30	2.10
SDRH105R-680M	68	20%	0.193	2.00	1.90
SDRH105R-820M	82	20%	0.219	1.80	1.60
SDRH105R-101M	100	20%	0.247	1.50	1.35
SDRH105R-121M	120	20%	0.298	1.40	1.18
SDRH105R-151M	150	20%	0.355	1.30	1.10
SDRH105R-181M	180	20%	0.393	1.20	1.00
SDRH105R-221M	220	20%	0.483	1.08	0.94
SDRH105R-271M	270	20%	0.632	0.88	0.80
SDRH105R-331M	330	20%	0.780	0.85	0.73
SDRH105R-391M	390	20%	0.957	0.78	0.70
SDRH105R-471M	470	20%	1.220	0.71	0.54
SDRH105R-561M	560	20%	1.352	0.65	0.52
SDRH105R-681M	680	20%	1.519	0.59	0.51
SDRH105R-821M	820	20%	1.694	0.51	0.48
SDRH105R-102M	1000	20%	1.946	0.49	0.42

Packaging Specifications:

Part No.	Tape Dimension W (mm)	Tape Dimension P (mm)	Tape Dimension W1 (mm)	Reel Dimensions A (mm)	Reel Dimensions B (mm)	Reel Dimensions C (mm)	Reel Dimensions D (mm)	REEL (PCS)	Inside Box (PCS)	Outside Carton (PCS)
SDRH105R	24	16	11.5	24.4	60	13	330	800	1600	6400

Cover Tape Peel Off Condition:

Cover tape peel force: 10 to 120g
Noodle strip peeling angle: 165 to 180

Reliability Testing:

Item	Requirements	Test Methods and Remarks
Terminal Strength (SMT)	Meet requirements without any loose terminal.	Pulling test based on terminal area. Solder paste thickness: 0.12mm. Speed: 1.0mm/s. Keep time: 101s.
Terminal Strength (DIP)	Meet requirements without any loose terminal.	Applied force based on terminal diameter. Duration: 10sec.
Resistance to Flexure	No visible mechanical damage.	Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping	No case deformation or change in appearance. No short and no open.	Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice in each direction.
Solderability	Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage.	Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Frequency varied between 10 and 55 Hz. Applied for 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec.
Low temperature Storage	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: -55~-402. Duration: 962 hours.
High temperature Storage	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: 85~1252. Duration: 962 hours.
Damp Heat (Steady States)	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering	No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%.	Reflow soldering twice. Peak temperature: 260+0/-5.
Resistance to solvent test	No case deformation or change in appearance or obliteration of marking.	Dip into IPA solvent for 50.5Min, dry for 5Min, brush 10 times.
Overload test	No smoke, no peculiar smell, no fire during test. Characteristics normal after test.	Apply twice rated current for 5 minutes.
Voltage resistance test	No breakdown during test. Characteristics normal after test.	DC1000V, Current: 1mA, Time: 1Min (for parts with two coils).

Recommended Reflow Soldering Curve:

The recommended reflow conditions are provided as a guideline and may require adjustment based on specific user equipment and process conditions.

Reminders for Using These Products:

Storage period: within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
Avoid direct contact with terminals by bare hands to prevent soldering inhibition.
Handle products carefully to prevent damage from dropping or improper removal.
Do not bend terminals with excessive stress to avoid wire fracture.
Do not rinse coils. Contact the manufacturer if cleaning is necessary.
Do not expose products to magnets or magnetic fields.
Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
Allow for sufficient thermal design margin due to self-heating when power is on.
For non-magnetic shielded types, careful coil layout is required on the PCB to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SDRH105R-331MT_C5127308.pdf

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