Molding SMD Power Inductors LanTu Micro SMS1050-470MT with Composite Structure Minimizing Buzz Noise

Molding SMD Power Inductors - SMS1050 Series

Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1050 Series are ultra-high current SMD power inductors designed for high-density installations. Featuring a thin profile with low DC resistance and ultra-high current capability, these magnetically shielded inductors offer strong anti-electromagnetic interference. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. These inductors are manufactured using low-loss alloy powder for die-casting, resulting in low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. They are suitable for frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. The series is RoHS, Halogen Free, and REACH compliant.

Applications

• PDA, notebook, desktop, server applications
• High current POL converters
• Battery powered devices
• DC/DC converters in distributed power systems

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SMS1050
• Type: Molding SMD Power Inductor
• Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Electrical Characteristics (Electrical specifications at 25)

Inductance Tolerance Codes

J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Packaging Codes

B: Bulk Package, T: Tape & Reel

Shape and Dimensions (dimensions are in mm)

Environmental Data

• Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Key Features

• Thin design with low DC resistance and ultra-high current capability.
• Magnetic shielding type with strong anti-electromagnetic interference, suitable for high-density installation.
• High reliability and excellent vibration resistance due to newly developed integral construction.
• Ultra-low buzz noise due to composite construction.
• Low impedance and small parasitic capacitance from die-casting with low-loss alloy powder.
• High efficiency with low winding DC resistance and low core eddy-current loss.
• Frequency up to 3MHz.
• Absolute maximum voltage 30VDC.

Test Equipment

• Inductance: WK3260B LCR meter or equivalent
• Current (Isat & Irms): WK3260B+WK3265B or equivalent
• DC Resistance: Chroma 16502 or equivalent

Product Identification Example

SMS 1050 100 M T

• : Inductance (e.g., 100 for 10 uH)
• : Type (SMS)
• : Tolerance (M for 20%)

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow conditions. Adjust and confirm based on user's environment/equipment.

Reminders for Using These Products

• Storage period within 12 months under specified conditions (5~40C, 35~65% RH).
• Avoid use and storage in corrosive gas environments.
• Do not touch terminals directly with bare hands.
• Handle products carefully to prevent damage.
• Do not bend terminals excessively.
• Do not rinse coils without contacting the manufacturer.
• Keep away from magnets or magnetic fields.
• Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid damage.
• Allow for sufficient thermal design margin due to self-heating.
• Careful coil layout is required for non-magnetic shield types to prevent malfunctions due to magnetic interference.

Molding SMD Power Inductors LanTu Micro SMS1050-470MT with Composite Structure Minimizing Buzz Noise Images