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Shielded SMD Power Inductors LanTu Micro SMRH4D28-100NT Designed for Portable Devices and OA Equipment

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Shielded SMD Power Inductors LanTu Micro SMRH4D28-100NT Designed for Portable Devices and OA Equipment

Current - Saturation (Isat) : 1A

Description : 1A SMD,4.7x4.7mm Fixed Inductors RoHS

Mfr. Part # : SMRH4D28-100NT

Model Number : SMRH4D28-100NT

Package : SMD,4.7x4.7mm

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Product Overview

The SMRH4D28 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for surface mounting applications. These inductors feature a closed magnetic circuit design to minimize leakage flux, high saturation current, and low DC resistance. They are available in various package sizes and a wide inductance range, making them suitable for power supplies in VTRs, OA equipment, notebook PCs, portable communication devices, and DC/DC converters.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMRH4D28
  • Type: Shielded SMD Power Inductors
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China (implied by company name and location)

Technical Specifications

Part No. Inductance (H) Tolerance Test Freq. DCR Max () Saturation Current Max (A) Temperature Rise Current Max (A) Dimensions (LWH mm)
SMRH4D28-1R5N 1.5 30% 100KHz 0.023 2.56 2.56 5.05.03.0
SMRH4D28-2R2N 2.2 30% 100KHz 0.031 2.04 2.04 5.05.03.0
SMRH4D28-3R3N 3.3 30% 100KHz 0.049 1.57 1.57 5.05.03.0
SMRH4D28-3R9N 3.9 30% 100KHz 0.064 1.44 1.44 5.05.03.0
SMRH4D28-4R7N 4.7 30% 100KHz 0.072 1.32 1.32 5.05.03.0
SMRH4D28-6R8N 6.8 30% 100KHz 0.441 1.12 1.12 5.05.03.0
SMRH4D28-8R2N 8.2 30% 100KHz 0.694 1.04 1.04 5.05.03.0
SMRH4D28-100N 10 30% 100KHz 0.709 1.00 1.00 5.05.03.0
SMRH4D28-120M 12 20% 100KHz 0.131 0.84 0.84 5.05.03.0
SMRH4D28-150M 15 20% 100KHz 0.149 0.76 0.76 5.05.03.0
SMRH4D28-180M 18 20% 100KHz 0.166 0.72 0.72 5.05.03.0
SMRH4D28-220M 22 20% 100KHz 0.235 0.70 0.70 5.05.03.0
SMRH4D28-270M 27 20% 100KHz 0.261 0.58 0.58 5.05.03.0
SMRH4D28-330M 33 20% 100KHz 0.378 0.56 0.56 5.05.03.0
SMRH4D28-390M 39 20% 100KHz 0.383 0.50 0.50 5.05.03.0
SMRH4D28-470M 47 20% 100KHz 0.587 0.48 0.48 5.05.03.0
SMRH4D28-560M 56 20% 100KHz 0.624 0.41 0.41 5.05.03.0
SMRH4D28-680M 68 20% 100KHz 0.699 0.35 0.35 5.05.03.0
SMRH4D28-820M 82 20% 100KHz 0.914 0.32 0.32 5.05.03.0
SMRH4D28-101M 100 20% 100KHz 1.102 0.29 0.29 5.05.03.0
SMRH4D28-121M 120 20% 100KHz 1.127 0.27 0.27 5.05.03.0
SMRH4D28-151M 150 20% 100KHz 1.135 0.24 0.24 5.05.03.0
SMRH4D28-181M 180 20% 100KHz 1.154 0.22 0.22 5.05.03.0
Environmental Data:
Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Dimensions (mm):
Part No. | A (Max) | B (Max) | C (Max) | D (Max) | E | F | G | H | J
SMRH4D28 5.0 5.0 3.0 6.9 4.5 1.5 5.3 1.9 1.5
Product Identification: SMRH 4D28 [Inductance] [Tolerance] [Packing]
Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: T: Tape & Reel, B: Bulk Package
Test Equipment: LCR Meter (HP4284A, HP4285A or equivalent), Current Meter (HP4284+42841A or equivalent), DCR Meter (Chroma 16502 or equivalent)
Definitions:
Saturation Current: DC current at which inductance drops 35% from its value without current.
Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.

Packaging Specifications

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) Reel (PCS) Inside Box (PCS) Outside Carton (PCS)
SMRH4D28 12 8 5.5 12.4 100 13 330 2000 8,000 32,000

Tape and Reel Specifications:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on sectional area of terminal (GB/T 2423.60-2008). Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s.
Terminal Strength (DIP) Meet requirements without any loose terminal. Applied force based on terminal diameter (GB/T 2423.60-2008). Keep time: 10 sec.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec (JIS C 5321:1997).
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction (GB/T 2423.7-2018).
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol (GB/T 2423.28-2005).
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Simple harmonic motion, 10 to 55 Hz, 1.5mm amplitude, 2 hours in each of 3 mutually perpendicular directions (GB/T 2423.10-2019).
Thermal Shock No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. 100 cycles of temperature shock between -55~40 and 85~125. Transforming interval: Max. 20 sec (GB/T 2423.22-2012 Method Na).
Low temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours (GB/T 2423.1-2008 Method Ab).
High temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 125~852. Duration: 962 hours (GB/T 2423.2-2008 Method Bb).
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours (GB/T 2423.3-2016).
Heat endurance of Reflow soldering No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. Reflow twice. Peak temperature: 260+0/-5 (GJB 360B-2009).
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times (IEC 68-2-45:1993).
Overload test During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. Apply twice rated current for 5 minutes (JIS C5311-6.13).
Voltage resistance test During test: no breakdown. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min (MIL-STD-202G Method 301).

Usage Reminders

  • Storage: Within 12 months, at 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals using bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or improper removal.
  • Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering Corrections: Corrections after mounting should be within specification conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Self-heating occurs when power is ON; ensure sufficient thermal design tolerance.
  • Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

2410121442_LanTu-Micro-SMRH4D28-100NT_C5127496.pdf


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